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Product Introduction
Let’s be honest, small parts inside a semiconductor chamber are often harder to source than the main controller boards. This AMAT 0010-27983 Focus Ring is a quartz component specifically designed for Centura DxZ and similar PVD/CVD equipment. Its main job is to control plasma distribution at the wafer edge, ensuring stable electrostatic chucking for 150 mm wafers during deposition.The real value here lies in maintaining process consistency. Made from high-purity fused silica, it withstands high temperatures and resists plasma corrosion. During our random warehouse inspections, we measured the step height with a vernier caliper, and it consistently holds at 1.2 mm with a smooth, scratch-free surface. For facility engineers, using this kind of New Surplus part to replace worn components not only passes internal spare parts audits but also saves weeks of waiting time compared to the standard OEM procurement process.
Key Technical Specifications
- Brand: AMAT (Applied Materials)
- Part Number: 0010-27983
- Product Type: Focus Ring
- Material: Quartz (Fused Silica)
- Compatible Wafer Size: 150 mm (6 inch)
- Structural Feature: Stepped design (Step height: 1.2 mm)
- Compatible Platforms: Centura, Centura DxZ
- Process Type: PVD, CVD, Etch
- Condition: New Original (New Surplus)
- Warranty: 1 Year
Application Scenarios & Pain Points
During a late-night shift at a wafer fab, an engineer was called in to troubleshoot a faulty Centura tool. The issue turned out to be non-uniform film thickness at the wafer edge. After hours of debugging, they found the culprit: the focus ring had worn down from prolonged plasma bombardment, causing edge electric field distortion. In situations like this, not having a spare part on hand means the entire production line grinds to a halt.The 0010-27983 Focus Ring is exactly the kind of part that solves these headaches:
- Guardian of Process Stability: During PVD sputtering, it secures the wafer edge via electrostatic chucking, preventing warping or shifting to ensure uniform film thickness.
- Plasma Boundary Control: In etch or CVD processes, it acts as a “dummy substrate” inside the chamber, controlling plasma reactivity at the wafer edge and reducing edge yield loss.
- Quick Turnaround Support: As a standard OEM part, it usually requires no complex recalibration after installation, helping equipment engineers get production back up and running fast.
- Cost-Benefit Balance: Compared to refurbished or third-party alternatives, the original focus ring might have a slightly higher upfront cost, but it eliminates the risk of scrapping an entire batch of wafers due to particulate contamination.
